Wafer Slicing Diamond Saw from China
Diamond wire saws slice ultra-thin wafers from monocrystalline silicon boules with minimal material loss. HTS 8474.80.0080 covers this as slicing machinery for semiconductor mineral substances in solid form. Essential wafer preparation equipment per statistical notes.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify diamond wire specs and wafer thickness capabilities (<100μm)
• Include semiconductor fab facility end-user letters