Wafer Edge Grinder from Mexico
Edge grinders chamfer wafer peripheries to prevent chipping during handling and processing. HTS 8474.80.0080 grinding machinery for semiconductor wafers. Improves yield in wafer fabrication.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify chip angle specs (15-45°)
• Verify 300mm wafer capacity
• Not general edge profiling; semiconductor handling proof required