Wafer Edge Grinder from Mexico
Edge grinders chamfer wafer peripheries to prevent chipping during handling and processing. HTS 8474.80.0080 grinding machinery for semiconductor wafers. Improves yield in wafer fabrication.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify chip angle specs (15-45°)
• Verify 300mm wafer capacity
• Not general edge profiling; semiconductor handling proof required