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8474.80.00.80/Wafer Edge Grinder/Japan

Wafer Edge Grinder from Japan

Edge grinders chamfer wafer peripheries to prevent chipping during handling and processing. HTS 8474.80.0080 grinding machinery for semiconductor wafers. Improves yield in wafer fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify chip angle specs (15-45°)

• Verify 300mm wafer capacity

• Not general edge profiling; semiconductor handling proof required

Wafer Edge Grinder from Japan — Import Duty Rate | HTS 8474.80.00.80