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8474.80.00.80/Wafer Edge Grinder/China

Wafer Edge Grinder from China

Edge grinders chamfer wafer peripheries to prevent chipping during handling and processing. HTS 8474.80.0080 grinding machinery for semiconductor wafers. Improves yield in wafer fabrication.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Specify chip angle specs (15-45°)

• Verify 300mm wafer capacity

• Not general edge profiling; semiconductor handling proof required

Wafer Edge Grinder from China — Import Duty Rate | HTS 8474.80.00.80