Silicon Wafer Lapper from Mexico
Wafer lappers use loose abrasives to achieve flatness tolerances on silicon wafers prior to polishing. Classified HTS 8474.80.0080 for grinding/lapping solid semiconductor mineral substances. Meets statistical note for wafer preparation equipment.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify flatness specs (e.g
• <1μm TTV) proving semiconductor precision
• Include abrasive slurry system documentation
• Distinguish from metal lapping; specify silicon/gallium arsenide compatibility