Silicon Wafer Lapper from Mexico
Wafer lappers use loose abrasives to achieve flatness tolerances on silicon wafers prior to polishing. Classified HTS 8474.80.0080 for grinding/lapping solid semiconductor mineral substances. Meets statistical note for wafer preparation equipment.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Certify flatness specs (e.g
• <1μm TTV) proving semiconductor precision
• Include abrasive slurry system documentation
• Distinguish from metal lapping; specify silicon/gallium arsenide compatibility