Silicon Wafer Lapper from Germany
Wafer lappers use loose abrasives to achieve flatness tolerances on silicon wafers prior to polishing. Classified HTS 8474.80.0080 for grinding/lapping solid semiconductor mineral substances. Meets statistical note for wafer preparation equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Certify flatness specs (e.g
• <1μm TTV) proving semiconductor precision
• Include abrasive slurry system documentation
• Distinguish from metal lapping; specify silicon/gallium arsenide compatibility