Silicon Wafer Lapper from China
Wafer lappers use loose abrasives to achieve flatness tolerances on silicon wafers prior to polishing. Classified HTS 8474.80.0080 for grinding/lapping solid semiconductor mineral substances. Meets statistical note for wafer preparation equipment.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Certify flatness specs (e.g
• <1μm TTV) proving semiconductor precision
• Include abrasive slurry system documentation
• Distinguish from metal lapping; specify silicon/gallium arsenide compatibility