Silicon Ingot Grinder from Japan
Precision grinders shape silicon ingots to uniform diameter with orientation flats for conductivity indication. HTS 8474.80.0080 for grinding solid semiconductor crystal boules. Wafer manufacturing equipment per statistical note (a)(ii)(A).
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify flat positioning accuracy for resistivity coding
• Include boule diameter range (100-450mm)
• Avoid optical grinder classification; emphasize mechanical mineral processing