8474.80.00.80/Silicon Ingot Grinder/Japan

Silicon Ingot Grinder from Japan

Precision grinders shape silicon ingots to uniform diameter with orientation flats for conductivity indication. HTS 8474.80.0080 for grinding solid semiconductor crystal boules. Wafer manufacturing equipment per statistical note (a)(ii)(A).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify flat positioning accuracy for resistivity coding

• Include boule diameter range (100-450mm)

• Avoid optical grinder classification; emphasize mechanical mineral processing