Silicon Ingot Grinder from Germany
Precision grinders shape silicon ingots to uniform diameter with orientation flats for conductivity indication. HTS 8474.80.0080 for grinding solid semiconductor crystal boules. Wafer manufacturing equipment per statistical note (a)(ii)(A).
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify flat positioning accuracy for resistivity coding
• Include boule diameter range (100-450mm)
• Avoid optical grinder classification; emphasize mechanical mineral processing