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8474.80.00.80/Gallium Arsenide Wafer Slicer/Mexico

Gallium Arsenide Wafer Slicer from Mexico

Specialized saws slice compound semiconductor wafers from GaAs boules with minimal subsurface damage. Classified HTS 8474.80.0080 for processing solid mineral semiconductor substances. Covers compound semis per statistical notes.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document GaAs-specific blade tensioning systems

• Include damage layer specs (<2μm)

• Distinguish from silicon saws by compound material handling

Gallium Arsenide Wafer Slicer from Mexico — Import Duty Rate | HTS 8474.80.00.80