Gallium Arsenide Wafer Slicer from Japan
Specialized saws slice compound semiconductor wafers from GaAs boules with minimal subsurface damage. Classified HTS 8474.80.0080 for processing solid mineral semiconductor substances. Covers compound semis per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document GaAs-specific blade tensioning systems
• Include damage layer specs (<2μm)
• Distinguish from silicon saws by compound material handling