Gallium Arsenide Wafer Slicer from Germany
Specialized saws slice compound semiconductor wafers from GaAs boules with minimal subsurface damage. Classified HTS 8474.80.0080 for processing solid mineral semiconductor substances. Covers compound semis per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document GaAs-specific blade tensioning systems
• Include damage layer specs (<2μm)
• Distinguish from silicon saws by compound material handling