8474.80.00.80/Crystal Boule Grinder/Japan

Crystal Boule Grinder from Japan

Crystal boule grinders precisely grind semiconductor crystal ingots to exact diameters and create orientation flats indicating conductivity. Falls under HTS 8474.80.0080 as grinding machinery for solid mineral substances (silicon boules). Prepares crystals for wafer slicing in semiconductor fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document grinding tolerances (e.g

• ±0.1mm) to prove precision mineral processing

• Pair with wafer manufacturing end-use statement

• Avoid classifying as general metalworking; specify semiconductor crystal material