Crystal Boule Grinder from China
Crystal boule grinders precisely grind semiconductor crystal ingots to exact diameters and create orientation flats indicating conductivity. Falls under HTS 8474.80.0080 as grinding machinery for solid mineral substances (silicon boules). Prepares crystals for wafer slicing in semiconductor fabrication.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document grinding tolerances (e.g
• ±0.1mm) to prove precision mineral processing
• Pair with wafer manufacturing end-use statement
• Avoid classifying as general metalworking; specify semiconductor crystal material