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8474.80.00.80/CMP Wafer Polisher/Japan

CMP Wafer Polisher from Japan

Chemical Mechanical Polishers (CMP) planarize silicon wafers using slurry and polishing pads for device fabrication readiness. Under HTS 8474.80.0080 as polishing machinery for semiconductor mineral wafers. Final wafer preparation step per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document slurry chemistry and removal rates (10-100nm/min)

• Reference SEMI standards compliance

• Not general surface grinders; prove single-wafer processing capability