CMP Wafer Polisher from Japan
Chemical Mechanical Polishers (CMP) planarize silicon wafers using slurry and polishing pads for device fabrication readiness. Under HTS 8474.80.0080 as polishing machinery for semiconductor mineral wafers. Final wafer preparation step per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document slurry chemistry and removal rates (10-100nm/min)
• Reference SEMI standards compliance
• Not general surface grinders; prove single-wafer processing capability