8474.80.00.80/CMP Wafer Polisher/Japan

CMP Wafer Polisher from Japan

Chemical Mechanical Polishers (CMP) planarize silicon wafers using slurry and polishing pads for device fabrication readiness. Under HTS 8474.80.0080 as polishing machinery for semiconductor mineral wafers. Final wafer preparation step per statistical notes.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document slurry chemistry and removal rates (10-100nm/min)

• Reference SEMI standards compliance

• Not general surface grinders; prove single-wafer processing capability

CMP Wafer Polisher from Japan — Import Duty Rate | HTS 8474.80.00.80