</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8474.80.00.80/CMP Wafer Polisher/Japan

CMP Wafer Polisher from Japan

Chemical Mechanical Polishers (CMP) planarize silicon wafers using slurry and polishing pads for device fabrication readiness. Under HTS 8474.80.0080 as polishing machinery for semiconductor mineral wafers. Final wafer preparation step per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Document slurry chemistry and removal rates (10-100nm/min)

• Reference SEMI standards compliance

• Not general surface grinders; prove single-wafer processing capability