8474.80.00.15/Wafer Grinder with Auto-Loading/Mexico

Wafer Grinder with Auto-Loading from Mexico

Fully automated back grinder with cassette-to-cassette wafer handling for high-volume 300mm wafer thinning. HTS 8474.80.0015 for semiconductor wafer grinding equipment.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Document FOUP/FOF cassette compatibility for cleanroom standards

• Specify throughput (wafers/hour) for production classification

Wafer Grinder with Auto-Loading from Mexico — Import Duty Rate | HTS 8474.80.00.15