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8474.80.00.15/Wafer Grinder with Auto-Loading/Mexico

Wafer Grinder with Auto-Loading from Mexico

Fully automated back grinder with cassette-to-cassette wafer handling for high-volume 300mm wafer thinning. HTS 8474.80.0015 for semiconductor wafer grinding equipment.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document FOUP/FOF cassette compatibility for cleanroom standards

• Specify throughput (wafers/hour) for production classification