Other
Machinery for sorting, screening, separating, washing, crushing, grinding, mixing or kneading earth, stone, ores or other mineral substances, in solid (including powder or paste) form; machinery for agglomerating, shaping or molding solid mineral fuels, ceramic paste, unhardened cements, plastering materials or other mineral products in powder or paste form; machines for forming foundry molds of sand; parts thereof: > Other machinery > For agglomerating, shaping or molding solid mineral fuels, ceramic paste, unhardened cements, plastering materials or other mineral products in powder or paste form: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8474.80.00.15
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds orientation flats indicating conductivity and resistivity. HTS 8474.80.0015 applies as grinding machinery for solid mineral substances in semiconductor preparation.
Gallium Arsenide Wafer Grinder
Specialized grinder for back-thinning compound semiconductor wafers (GaAs) to precise thicknesses for optoelectronic applications. Fits HTS 8474.80.0015 as grinding machinery for solid mineral semiconductor substances.
Wafer Edge Profiling Grinder
Precision grinder creating rounded wafer edges to prevent chipping during handling and processing. Classified under HTS 8474.80.0015 for grinding semiconductor mineral wafers.
CMP Wafer Polishing Platform
Chemical Mechanical Planarization platform for final wafer surface polishing to atomic flatness before circuit fabrication. Though primarily polishing, classified HTS 8474.80.0015 when configured for initial crystal polishing.
Ingot Cropping Saw
Band saw that precisely crops the ends of silicon ingots to square orientation before main grinding. Classified HTS 8474.80.0015 for initial shaping of solid mineral ingots.
Czochralski Crystal Puller
A Czochralski method machine used to grow monocrystalline silicon boules from molten semiconductor material by precisely pulling and rotating a seed crystal. It falls under HTS 8474.80.0015 as machinery for shaping or molding mineral substances in solid form, specifically for processing semiconductor crystal growth classified as a mineral product.
Float Zone Crystal Grower
Float zone equipment employs a narrow molten zone to purify and grow high-purity silicon crystals from polycrystalline rods, avoiding crucible contamination. Classified in HTS 8474.80.0015 for its role in shaping solid mineral semiconductor materials into precise crystal forms.
Semiconductor Wafer Slicing Saw
High-precision inner-diameter saw that slices ultra-thin wafers from monocrystalline semiconductor boules while minimizing material damage. Falls under HTS 8474.80.0015 as slicing machinery for solid mineral substances in wafer manufacturing.
Silicon Wafer Lapping Machine
Lapping equipment that abrasively removes material from wafer surfaces to achieve precise flatness and thickness uniformity for semiconductor fabrication. Classified HTS 8474.80.0015 for grinding/lapping solid mineral wafers.
Crystal boule Grinder-Polisher
Dual-function machine that grinds semiconductor boules to diameter then polishes flats for crystal orientation marking. HTS 8474.80.0015 covers grinding/polishing of solid mineral semiconductor crystals.
Silicon Ingot Shaping Machine
Automated machinery that profiles silicon ingots by grinding to standard diameters (150mm-450mm) for wafer production. HTS 8474.80.0015 for shaping solid mineral semiconductor materials.
Diamond Wire Wafer Slicer
Modern multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of thin wafers from silicon boules, minimizing kerf loss. HTS 8474.80.0015 for slicing solid mineral substances.
Crystal Annealing Furnace
High-temperature furnace for annealing semiconductor crystals post-grinding to relieve stresses before wafer slicing. HTS 8474.80.0015 when integral to mineral shaping process.
Wafer Grinder with Auto-Loading
Fully automated back grinder with cassette-to-cassette wafer handling for high-volume 300mm wafer thinning. HTS 8474.80.0015 for semiconductor wafer grinding equipment.
Sapphire Wafer Grinding Machine
Heavy-duty grinder for synthetic sapphire (Al2O3) wafers used in LED and power electronics substrates. Fits HTS 8474.80.0015 as grinding machinery for solid mineral substrates.