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CMP Wafer Polishing Platform

Chemical Mechanical Planarization platform for final wafer surface polishing to atomic flatness before circuit fabrication. Though primarily polishing, classified HTS 8474.80.0015 when configured for initial crystal polishing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFree+37.5%37.5%
πŸ‡²πŸ‡½MexicoFree+10.0%10%
πŸ‡¨πŸ‡¦CanadaFree+10.0%10%
πŸ‡©πŸ‡ͺGermanyFree+10.0%10%
πŸ‡―πŸ‡΅JapanFree+12.5%12.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

9017.20.70Same rate: 37.5%

If other optical polishing machines

Surface flatness polishers may classify under optical Chapter 90.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code β€” and can price the duty on it in the same conversation.

Import Tips & Compliance

β€’ Distinguish from Chapter 90 testing by emphasizing material removal function

β€’ Document pad conditioning and slurry systems as grinding consumables

β€’ Avoid CMP-specific classification by focusing on crystal prep application

Related Products under HTS 8474.80.00.15

Crystal Boule Grinder

Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds orientation flats indicating conductivity and resistivity. HTS 8474.80.0015 applies as grinding machinery for solid mineral substances in semiconductor preparation.

Gallium Arsenide Wafer Grinder

Specialized grinder for back-thinning compound semiconductor wafers (GaAs) to precise thicknesses for optoelectronic applications. Fits HTS 8474.80.0015 as grinding machinery for solid mineral semiconductor substances.

Wafer Edge Profiling Grinder

Precision grinder creating rounded wafer edges to prevent chipping during handling and processing. Classified under HTS 8474.80.0015 for grinding semiconductor mineral wafers.

Ingot Cropping Saw

Band saw that precisely crops the ends of silicon ingots to square orientation before main grinding. Classified HTS 8474.80.0015 for initial shaping of solid mineral ingots.

Czochralski Crystal Puller

A Czochralski method machine used to grow monocrystalline silicon boules from molten semiconductor material by precisely pulling and rotating a seed crystal. It falls under HTS 8474.80.0015 as machinery for shaping or molding mineral substances in solid form, specifically for processing semiconductor crystal growth classified as a mineral product.

Float Zone Crystal Grower

Float zone equipment employs a narrow molten zone to purify and grow high-purity silicon crystals from polycrystalline rods, avoiding crucible contamination. Classified in HTS 8474.80.0015 for its role in shaping solid mineral semiconductor materials into precise crystal forms.