8474.80.00.15/Wafer Grinder with Auto-Loading/Japan

Wafer Grinder with Auto-Loading from Japan

Fully automated back grinder with cassette-to-cassette wafer handling for high-volume 300mm wafer thinning. HTS 8474.80.0015 for semiconductor wafer grinding equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document FOUP/FOF cassette compatibility for cleanroom standards

• Specify throughput (wafers/hour) for production classification