Wafer Grinder with Auto-Loading from Canada
Fully automated back grinder with cassette-to-cassette wafer handling for high-volume 300mm wafer thinning. HTS 8474.80.0015 for semiconductor wafer grinding equipment.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document FOUP/FOF cassette compatibility for cleanroom standards
• Specify throughput (wafers/hour) for production classification