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8474.80.00.15/Wafer Edge Profiling Grinder/Mexico

Wafer Edge Profiling Grinder from Mexico

Precision grinder creating rounded wafer edges to prevent chipping during handling and processing. Classified under HTS 8474.80.0015 for grinding semiconductor mineral wafers.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify edge geometry tolerances (chamfer angle, radius)

• Document compatibility with wafer handling cassettes

• Common misclassification as general edge grinders without wafer specs

Wafer Edge Profiling Grinder from Mexico — Import Duty Rate | HTS 8474.80.00.15