Wafer Edge Profiling Grinder from Mexico
Precision grinder creating rounded wafer edges to prevent chipping during handling and processing. Classified under HTS 8474.80.0015 for grinding semiconductor mineral wafers.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge geometry tolerances (chamfer angle, radius)
• Document compatibility with wafer handling cassettes
• Common misclassification as general edge grinders without wafer specs