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8474.80.00.15/Wafer Edge Profiling Grinder/Japan

Wafer Edge Profiling Grinder from Japan

Precision grinder creating rounded wafer edges to prevent chipping during handling and processing. Classified under HTS 8474.80.0015 for grinding semiconductor mineral wafers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify edge geometry tolerances (chamfer angle, radius)

• Document compatibility with wafer handling cassettes

• Common misclassification as general edge grinders without wafer specs