Wafer Edge Profiling Grinder from Japan
Precision grinder creating rounded wafer edges to prevent chipping during handling and processing. Classified under HTS 8474.80.0015 for grinding semiconductor mineral wafers.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify edge geometry tolerances (chamfer angle, radius)
• Document compatibility with wafer handling cassettes
• Common misclassification as general edge grinders without wafer specs