Wafer Edge Profiling Grinder from Germany
Precision grinder creating rounded wafer edges to prevent chipping during handling and processing. Classified under HTS 8474.80.0015 for grinding semiconductor mineral wafers.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify edge geometry tolerances (chamfer angle, radius)
• Document compatibility with wafer handling cassettes
• Common misclassification as general edge grinders without wafer specs