8474.80.00.15/Wafer Edge Profiling Grinder/China

Wafer Edge Profiling Grinder from China

Precision grinder creating rounded wafer edges to prevent chipping during handling and processing. Classified under HTS 8474.80.0015 for grinding semiconductor mineral wafers.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Specify edge geometry tolerances (chamfer angle, radius)

• Document compatibility with wafer handling cassettes

• Common misclassification as general edge grinders without wafer specs