</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8474.80.00.15/Wafer Edge Profiling Grinder/Canada

Wafer Edge Profiling Grinder from Canada

Precision grinder creating rounded wafer edges to prevent chipping during handling and processing. Classified under HTS 8474.80.0015 for grinding semiconductor mineral wafers.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify edge geometry tolerances (chamfer angle, radius)

• Document compatibility with wafer handling cassettes

• Common misclassification as general edge grinders without wafer specs