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8474.80.00.15/Silicon Wafer Lapping Machine/Mexico

Silicon Wafer Lapping Machine from Mexico

Lapping equipment that abrasively removes material from wafer surfaces to achieve precise flatness and thickness uniformity for semiconductor fabrication. Classified HTS 8474.80.0015 for grinding/lapping solid mineral wafers.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify flatness specs (e.g

• <1μm TTV) proving semiconductor application

• Include slurry composition and particle size data for classification support

Silicon Wafer Lapping Machine from Mexico — Import Duty Rate | HTS 8474.80.00.15