Silicon Wafer Lapping Machine from Mexico
Lapping equipment that abrasively removes material from wafer surfaces to achieve precise flatness and thickness uniformity for semiconductor fabrication. Classified HTS 8474.80.0015 for grinding/lapping solid mineral wafers.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify flatness specs (e.g
• <1μm TTV) proving semiconductor application
• Include slurry composition and particle size data for classification support