8474.80.00.15/Silicon Wafer Lapping Machine/Japan

Silicon Wafer Lapping Machine from Japan

Lapping equipment that abrasively removes material from wafer surfaces to achieve precise flatness and thickness uniformity for semiconductor fabrication. Classified HTS 8474.80.0015 for grinding/lapping solid mineral wafers.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify flatness specs (e.g

• <1μm TTV) proving semiconductor application

• Include slurry composition and particle size data for classification support

Silicon Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8474.80.00.15