8474.80.00.15/Silicon Wafer Lapping Machine/Japan

Silicon Wafer Lapping Machine from Japan

Lapping equipment that abrasively removes material from wafer surfaces to achieve precise flatness and thickness uniformity for semiconductor fabrication. Classified HTS 8474.80.0015 for grinding/lapping solid mineral wafers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify flatness specs (e.g

• <1μm TTV) proving semiconductor application

• Include slurry composition and particle size data for classification support