Silicon Wafer Lapping Machine from Germany
Lapping equipment that abrasively removes material from wafer surfaces to achieve precise flatness and thickness uniformity for semiconductor fabrication. Classified HTS 8474.80.0015 for grinding/lapping solid mineral wafers.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify flatness specs (e.g
• <1μm TTV) proving semiconductor application
• Include slurry composition and particle size data for classification support