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8474.80.00.15/Silicon Ingot Shaping Machine/Japan

Silicon Ingot Shaping Machine from Japan

Automated machinery that profiles silicon ingots by grinding to standard diameters (150mm-450mm) for wafer production. HTS 8474.80.0015 for shaping solid mineral semiconductor materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document diameter range capability (4"-12") proving commercial semiconductor use

• Include throughput specs (ingots/hour) for production classification