Silicon Ingot Shaping Machine from Canada
Automated machinery that profiles silicon ingots by grinding to standard diameters (150mm-450mm) for wafer production. HTS 8474.80.0015 for shaping solid mineral semiconductor materials.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document diameter range capability (4"-12") proving commercial semiconductor use
• Include throughput specs (ingots/hour) for production classification