Semiconductor Wafer Slicing Saw from Mexico
High-precision inner-diameter saw that slices ultra-thin wafers from monocrystalline semiconductor boules while minimizing material damage. Falls under HTS 8474.80.0015 as slicing machinery for solid mineral substances in wafer manufacturing.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify blade specifications for semiconductor kerf loss minimization (<50μm)
• Document integration with wafer handling systems for statistical note compliance