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8474.80.00.15/Semiconductor Wafer Slicing Saw/Japan

Semiconductor Wafer Slicing Saw from Japan

High-precision inner-diameter saw that slices ultra-thin wafers from monocrystalline semiconductor boules while minimizing material damage. Falls under HTS 8474.80.0015 as slicing machinery for solid mineral substances in wafer manufacturing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Certify blade specifications for semiconductor kerf loss minimization (<50μm)

• Document integration with wafer handling systems for statistical note compliance

Semiconductor Wafer Slicing Saw from Japan — Import Duty Rate | HTS 8474.80.00.15