8474.80.00.15/Sapphire Wafer Grinding Machine/Japan

Sapphire Wafer Grinding Machine from Japan

Heavy-duty grinder for synthetic sapphire (Al2O3) wafers used in LED and power electronics substrates. Fits HTS 8474.80.0015 as grinding machinery for solid mineral substrates.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify Mohs hardness handling capability (sapphire=9)

• Document substrate vs. device wafer distinction