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8474.80.00.15/Gallium Arsenide Wafer Grinder/Mexico

Gallium Arsenide Wafer Grinder from Mexico

Specialized grinder for back-thinning compound semiconductor wafers (GaAs) to precise thicknesses for optoelectronic applications. Fits HTS 8474.80.0015 as grinding machinery for solid mineral semiconductor substances.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify material hardness compatibility (GaAs is brittle vs. silicon)

• Include handling system specs for fragile compound wafers

• Avoid general classification by documenting III-V semiconductor applications

Gallium Arsenide Wafer Grinder from Mexico — Import Duty Rate | HTS 8474.80.00.15