Gallium Arsenide Wafer Grinder from Mexico
Specialized grinder for back-thinning compound semiconductor wafers (GaAs) to precise thicknesses for optoelectronic applications. Fits HTS 8474.80.0015 as grinding machinery for solid mineral semiconductor substances.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify material hardness compatibility (GaAs is brittle vs. silicon)
• Include handling system specs for fragile compound wafers
• Avoid general classification by documenting III-V semiconductor applications