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8474.80.00.15/Gallium Arsenide Wafer Grinder/Japan

Gallium Arsenide Wafer Grinder from Japan

Specialized grinder for back-thinning compound semiconductor wafers (GaAs) to precise thicknesses for optoelectronic applications. Fits HTS 8474.80.0015 as grinding machinery for solid mineral semiconductor substances.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify material hardness compatibility (GaAs is brittle vs. silicon)

• Include handling system specs for fragile compound wafers

• Avoid general classification by documenting III-V semiconductor applications