Gallium Arsenide Wafer Grinder from Germany
Specialized grinder for back-thinning compound semiconductor wafers (GaAs) to precise thicknesses for optoelectronic applications. Fits HTS 8474.80.0015 as grinding machinery for solid mineral semiconductor substances.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify material hardness compatibility (GaAs is brittle vs. silicon)
• Include handling system specs for fragile compound wafers
• Avoid general classification by documenting III-V semiconductor applications