Gallium Arsenide Wafer Grinder from Canada
Specialized grinder for back-thinning compound semiconductor wafers (GaAs) to precise thicknesses for optoelectronic applications. Fits HTS 8474.80.0015 as grinding machinery for solid mineral semiconductor substances.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify material hardness compatibility (GaAs is brittle vs. silicon)
• Include handling system specs for fragile compound wafers
• Avoid general classification by documenting III-V semiconductor applications