8474.80.00.15/Diamond Wire Wafer Slicer/Japan

Diamond Wire Wafer Slicer from Japan

Modern multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of thin wafers from silicon boules, minimizing kerf loss. HTS 8474.80.0015 for slicing solid mineral substances.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify wire diameter (0.1-0.2mm) and slice thickness capability (<100μm)

• Include slurry-free operation documentation for modern classification