Diamond Wire Wafer Slicer from Germany
Modern multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of thin wafers from silicon boules, minimizing kerf loss. HTS 8474.80.0015 for slicing solid mineral substances.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify wire diameter (0.1-0.2mm) and slice thickness capability (<100μm)
• Include slurry-free operation documentation for modern classification