Diamond Wire Wafer Slicer from Canada
Modern multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of thin wafers from silicon boules, minimizing kerf loss. HTS 8474.80.0015 for slicing solid mineral substances.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify wire diameter (0.1-0.2mm) and slice thickness capability (<100μm)
• Include slurry-free operation documentation for modern classification