Silicon Wafer Preparation Lapper from Japan
Lapping machine that grinds silicon wafers to tight flatness tolerances before fabrication processing. HTS 8474.20.00 covers this as grinding equipment for semiconductor mineral wafers in solid form. Critical for achieving surface planarity in chip manufacturing.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document wafer thickness tolerances (<1 micron) to prove semiconductor-specific precision
• Avoid misclassification by specifying 'lapping' vs. final chemical-mechanical polishing
• Comply with cleanroom compatibility certifications for US import validation