Silicon Wafer Preparation Lapper from Germany
Lapping machine that grinds silicon wafers to tight flatness tolerances before fabrication processing. HTS 8474.20.00 covers this as grinding equipment for semiconductor mineral wafers in solid form. Critical for achieving surface planarity in chip manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document wafer thickness tolerances (<1 micron) to prove semiconductor-specific precision
• Avoid misclassification by specifying 'lapping' vs. final chemical-mechanical polishing
• Comply with cleanroom compatibility certifications for US import validation