Silicon Wafer Preparation Lapper from China
Lapping machine that grinds silicon wafers to tight flatness tolerances before fabrication processing. HTS 8474.20.00 covers this as grinding equipment for semiconductor mineral wafers in solid form. Critical for achieving surface planarity in chip manufacturing.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document wafer thickness tolerances (<1 micron) to prove semiconductor-specific precision
• Avoid misclassification by specifying 'lapping' vs. final chemical-mechanical polishing
• Comply with cleanroom compatibility certifications for US import validation