8474.20.00/Semiconductor Wafer Edge Grinder/Japan

Semiconductor Wafer Edge Grinder from Japan

Edge grinding machine that chamfers and shapes wafer peripheries to prevent chipping during handling. HTS 8474.20.00 for grinding semiconductor wafers as solid mineral products. Improves wafer strength and handling in fabs.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document edge profiles (laser diced vs sawn wafers) for accurate classification

• Specify wafer sizes supported (200mm, 300mm, 450mm)

• Include safety interlock certifications for US market entry