Semiconductor Wafer Edge Grinder from Germany
Edge grinding machine that chamfers and shapes wafer peripheries to prevent chipping during handling. HTS 8474.20.00 for grinding semiconductor wafers as solid mineral products. Improves wafer strength and handling in fabs.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document edge profiles (laser diced vs sawn wafers) for accurate classification
• Specify wafer sizes supported (200mm, 300mm, 450mm)
• Include safety interlock certifications for US market entry