Czochralski Crystal Puller Grinder from Japan
A precision grinding machine used to grind semiconductor crystal boules produced by Czochralski method to exact diameters for wafer slicing. It falls under HTS 8474.20.00 as a grinding machine for mineral substances like silicon crystals in solid form. Essential for semiconductor manufacturing to ensure conductivity and resistivity specifications.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify machine specs confirm grinding of solid mineral substances like silicon boules, not just polishing
• Include technical datasheets proving semiconductor application to avoid reclassification to Chapter 90
• Ensure EPA compliance for dust emission controls in mineral processing equipment