Czochralski Crystal Puller Grinder from Japan
A precision grinding machine used to grind semiconductor crystal boules produced by Czochralski method to exact diameters for wafer slicing. It falls under HTS 8474.20.00 as a grinding machine for mineral substances like silicon crystals in solid form. Essential for semiconductor manufacturing to ensure conductivity and resistivity specifications.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify machine specs confirm grinding of solid mineral substances like silicon boules, not just polishing
• Include technical datasheets proving semiconductor application to avoid reclassification to Chapter 90
• Ensure EPA compliance for dust emission controls in mineral processing equipment