Czochralski Crystal Puller Grinder from China
A precision grinding machine used to grind semiconductor crystal boules produced by Czochralski method to exact diameters for wafer slicing. It falls under HTS 8474.20.00 as a grinding machine for mineral substances like silicon crystals in solid form. Essential for semiconductor manufacturing to ensure conductivity and resistivity specifications.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify machine specs confirm grinding of solid mineral substances like silicon boules, not just polishing
• Include technical datasheets proving semiconductor application to avoid reclassification to Chapter 90
• Ensure EPA compliance for dust emission controls in mineral processing equipment