boule Crystal Diameter Grinder from Japan
Automated grinder that shapes semiconductor boules to uniform diameter specifications for consistent wafer yield. Classified HTS 8474.20.00 for grinding solid mineral substances like silicon crystals. Includes flats grinding for doping orientation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include boule size range (150-450mm) and flat positioning specs in technical files
• Distinguish from polishers by emphasizing rough grinding operations
• Comply with vibration isolation standards for precision equipment imports