Boule Flattening Grinder Wheel
Diamond wheel for grinding flats on semiconductor crystal boules to indicate resistivity and conductivity type. HTS 8473.50.9000 for use with crystal preparation equipment in 8471. Creates precise orientation markers.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general interchangeable tool bits
Grinding wheels not tied to specific machines classify as general tool bits in Chapter 82.
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Import Tips & Compliance
• Flat length/angle specifications; diamond grit size certification; coolant compatibility documentation
Related Products under HTS 8473.50.90.00
Czochralski Crystal Puller Mechanism
This precision-engineered pulling mechanism is a key part of Czochralski crystal growers used to produce monocrystalline silicon boules for semiconductor wafers. It falls under HTS 8473.50.9000 as a part equally suitable for semiconductor manufacturing machines in headings 8470-8472. The component controls the rotation and extraction rate during crystal growth.
Wafer Slicing Diamond Saw Blade
High-precision diamond-impregnated saw blade designed exclusively for slicing semiconductor boules into thin wafers in wafer preparation equipment. Classified under HTS 8473.50.9000 as a part suitable for machines of 8471 used in semiconductor processing. Ensures minimal material loss and precise wafer thickness.
Crystal Boule Grinder Spindle Assembly
Rotating spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Falls under HTS 8473.50.9000 as it works with semiconductor processing machines across 8470-8472 headings. Provides vibration-free precision grinding.
Wafer Lapping Plate
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve ultra-flat surfaces on semiconductor wafers before fabrication. HTS 8473.50.9000 classification due to principal use with 8471 semiconductor processing machines. Critical for wafer planarity specifications.
Float Zone Crystal Furnace RF Coil
Radio frequency induction coil for float zone crystal growth furnaces that melt and purify semiconductor material without crucibles. Classifies under HTS 8473.50.9000 as a part for semiconductor machines in 8471. Enables zone refining for ultra-pure silicon.
Wafer Polishing Head Assembly
Multi-head polishing assembly that holds and rotates semiconductor wafers against polishing pads for mirror-finish surfaces. HTS 8473.50.9000 as equally suitable for various 8471 wafer processing machines. Achieves sub-micron surface roughness.