RF Signal Processor Board for Plasma Etchers from Japan
Printed circuit assembly processing RF impedance matching signals for plasma etching tools in semiconductor device fabrication, HTS 8473.50.30.00 due to equal suitability with 8471 RF boards and 8473 etchers. Enables precise material removal at wafer level.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• FCC compliance docs required for RF boards; include frequency specs
• Shielded packaging essential; RF interference risks customs delays
• Classify carefully—RF dominance may trigger Chapter 85 review